Posts Tagged packaging

K 2013: Dynisco’s innovative Vertex pressure sensor delivers on its promise

Saturday, October 19th, 2013 | Permalink

Düsseldorf – In a marked departure from traditional sensor technology, Dynisco’s Vertex pressure sensor for plastics extrusion applications, which is making its trade show debut here at K, has done away with the need for sensing with the help of mechanical structures or fill media. Instead, the Vertex offers direct sensing at the tip. Tagging Options Domain:  All Sites Keywords:  k 2013 pressure sensor injection molding read more

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K 2013: Dynisco’s innovative Vertex pressure sensor delivers on its promise